二极管的封装设计

二极管的封装设计

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二极管的封装
摘要： 本文介绍了二极管的多种形式封装结构及技术，针对封装材料在使用中的缺陷，综述了对环氧树脂的增韧、提高耐热性、改善透明性、改善加工性能的研究现状，并指出了其应用前景及国内外封装的差异性。
关键词：LED；二极管；二极管的封装。

毕业设计说明书目录
1 引言                                                               1
2 二极管封装的特殊性                                                 1
3 产品封装结构类型                                                   2
4 各种封装                                                           3
4.1最简单的LED                                                  3
4.2引脚式封装                                                   5
4.3表面贴装封装                                                 6
4.4功率型封装                                                   6
4.5高功率发光二极管封装                                         8
4.5.1封装技术介绍                                               8
4.5.2 HB-LED封装工艺                                            9
4.5.2.1单芯片封装                                               9
4.5.2.2多芯片阵列                                               9
4.5.2.3电气连接                                                 9
5 二极管封装材料研究                                                 10
5.1研究反向                                                     10
5.1.1增韧                                                       10
5.1.2提高耐热性                                                 10
5.1.3改善透明性                                                 10
5.1.4改善加工性能                                               10
5.1.4.1提高固化速度                                             10
5.1.4.2降低固化温度                                             10
5.1.4.3脱模技术                                                 11
5.2各种材料                                                     11
5.2.1环氧树脂                                                   11
5.2.2环氧树脂胶粉                                               11
5.2.3含Sil基与芳烷基的MQ硅树脂作交联剂的苯基硅树脂封装料      11
5.2.3.1概述                                                     11
5.2.3.2封装料的配制                                             12
5.2.4含2官能硅氧烷链段的硅树脂封装料                           13
5.2.4.1概述                                                     13
5.2.4.2封装料的配制                                            13
5.2.5 LED透镜材料                                              14
6 二极管封装技术关键                                                 15
7 LED发展及应用前景                                                 16
8 中国LED封装技术与国外的差异                                       18
   8.1封装生产及测试设备差异                                        18
   8.2 LED芯片差异                                                  19
   8.3封装辅助材料差异                                              19
   8.4封装设计差异                                                  19
9 参考文献                                                           20

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