0.5μm COMS金属硅化物工艺技术研究1

0.5μm COMS金属硅化物工艺技术研究1

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0.5μm CMOS金属硅化物工艺技术研究

摘要: 金属硅化物广泛用于微电子器件中的源、漏、栅极与金属电极间的接触, 是制备纳米集成电路的关键材料之一。本文对不同硅化物薄膜的特性进行了分析并对适用于0.5微米CMOS 器件的各种自对准硅化物工艺进行了讨论。
关键词: 金属硅化物；薄膜；自对准；NiSi；工艺模块；

毕业设计说明书目录
摘要.............................................................................................................................1
引言.............................................................................................................................1
第1章  金属硅化物的基础知识............................................................................ 1
   1.1　金属硅化物的概念..................................................................................... 2
   1.2　金属硅化物的性质..................................................................................... 2
   1.3  金属硅化物的应用......................................................................................2
第2章  金属硅化物的工艺特性............................................................................ 2
   2.1  钛硅化物TiSi2............................................................................................ 5
   2.2  钴硅化物CoSi2........................................................................................... 5
   2.3  镍硅化物NiSi............................................................................................. 6
   2.4  镍硅化物同钛，钴硅化物的比较..............................................................8
第3章  不同硅化物薄膜的电阻率....................................................................... 10
   3.1  常规T iSi2 薄膜的方块电阻与线宽的关系............................................ 12
   3.2   NiSi 薄膜的方块电阻与退火温度和线宽的关系................................. 12
   3.3  不同硅化物薄膜的耗硅量.........................................................................12
   3.4.  不同硅化物薄膜的热稳定性....................................................................13
第4章  稀土金属硅化物........................................................................................14
第5章  自对准硅化物（Self-Aligned Salicides）技术....................................... 15
   5.1  Salicide 工艺介绍......................................................................................16
   5.2  工艺模块流程............................................................................................ 20
   5.3  工艺模块控制要点.....................................................................................21
   5.4  工艺模块结果............................................................................................ 21
   5.5  自对准金属硅化物制备的可能问题点.....................................................23
第6章  金属硅化物的性能与缺陷监测评价....................................................... 25
   6.1  非晶界面层中的金属硅化物成核检测.................................................... 25
   6.2  金属硅化物生成检测.................................................................................25
   6.3  缺陷检测................................................................................................... 26
   6.4  热稳定性分析........................................................................................... 26
第7章  结语........................................................................................................27
参考文献................................................................................................................28

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